| Project | DA403-COC | DA403-COB | DA403-FC | |
| Machine performance | Equipment accuracy | ±3μm@3sigma | ||
| Chip rotation | ±0.1°@3sigma | |||
| Cycle | ≤8s(Excluding temperature curve) | ≤3s | ≤8S | |
| Bonding head accuracy | X(0.5um),Z(0.5um),Theta(0.01deg) | |||
| Solid-state table accuracy | X(0.5um),Y(0.5um) | |||
| Material processing capability | Wafer size | 3 crystal rings 6 inchesWafer Ring(2 inchesWaffle-park,Gel-Pak) | ||
| Chip size | 0.15*0.15-8*8mm | |||
| Substrate size |
(50-300mm)x(56-98mm)x(0.7-1.6mm) Length x width x thickness |
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| Box size |
(110-320mm)x(56- 130mm)x(68- 190mm), Length x width x thickness |
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| Bangtou system | Bonding power | 20-800 g (According to different configurations) | ||
| Image recognition system | PR system | 256 gray levels | ||
| Resolution | 2448pixelx2048pixel*Optional according to needs | |||
| Angular tolerance | ±0.01° | |||
| Machine size and weight | Size | 1637x1245x1965mm(Length x Width x Height) | ||
| Weight | 1220kg | |||
