| Project | DA402 | |
| Machine performance | Equipment accuracy | ±3μm@3sigma |
| Chip rotation | ±0.3°@3sigma | |
| cycle | ≤4s(Depending on the material) | |
| Bonding head accuracy | X(0.lum),Z(0.5um),Theta(0.0ldeg) | |
| Solid-state table accuracy | X(0.1um),Y(0.1um) | |
| Material processing capability | Wafer size |
3 Wafer Ring 6 times Wafer Rin g (including Waffle-park, etc.) |
| Chip size | 0.15 x 0.158x8mm | |
| Substrate size |
(50- 175mm)x(56-98mm)x(0.7- 1.6mm) Length x width x thickness |
|
| Box size |
(110- 320mm)x(56- 130mm)x(68- 190mm), Length x Width x Height |
|
| Bangtou system | Bonding power | 20-800 g (Based on different configurations) |
| Image recognition system | PR system | 256 gray levels |
| Resolution | 2448pixelx2048pixel*Optional according to needs | |
| Angular tolerance | ±0.01° | |
| Machine size and weight | Size | 1320x1120x 1760mm(Length x Width x Height) |
| Weight | 980kg |
