| Projects | DA401A | |
| Machine performance | XY placement accuracy | ±3µm @ 3sigma |
| Chip rotation | ±0.3°@ 3sigma | |
| Bonding head accuracy | X(0.1um),Z(0.5um),Theta(0.01deg) | |
| Solid-state table accuracy | X ( 0.1um ) ，Y ( 0.1um ) ，Theta (0.0072deg) | |
| Material handling capability | Wafer size | Three 6-inch wafer rings (including Waffle Park, etc.) |
| Chip size | 0.17x0.17-8x8mm | |
| Substrate size | 50-180mm x 56-75mm x 0.7-1.6mm(Length x Width x Thickness) | |
| Box size | 110-320mm x 56- 130mm x 68- 190mm(Length x Width x Height) | |
| Keyhead system | Bonding strength | 20-300 g(Based on different configurations) |
| Image recognition systems | PR system | 256 gray levels |
| Resolution | 2448pixel x2048pixel | |
| Angle tolerance | ±0.01° | |
| Machine size and weight | Size | 1900x1100x1700 mm(Length x Width x Height) |
| Weight | 1170kg |
