| Products | Models | Characteristic | Scope of application |
| Bonded copper wires | YC1 | 5N，High purity copper wire, low hardness, better ball formation properties | LED packages, IC packages (DIP, SIP, SOP, QFP), discrete devices (TO, SOP, SOD) |
| YC2 series | 4N，Flexible bonded copper wire, patented invention, low hardness, high electrical conductivity, good fatigue resistance | ||
| YC3 series | 3N，Small alloy copper wire, good ball formation, high corrosion resistance, high fatigue resistance | ||
| YC4 | 2N，Large alloy copper wire, high reliability, high dielectric strength, good ball formation | ||
