| Products | Models | Purity | Characteristic | Scope of application |
| Bonded alloy wire | YG1、YG3、YG5、YG6、YG7 | ≥99.99% | Used for most normal and high speed bonding, trace doping, higher strength and arc stability | LED mid to high end packages and high end IC packages (LQFP, BGA, QFN, QFP, DIP, SIP, CSP, etc.) |
| YG8 | ≥99% | High doping, high reliability, low long arcs | High-end IC packaging (QFN, LQFP, BGA, CSP) | |
| Alloy gold wire | YGA1 | 80Au | Precious metal addition, better mechanical strength than gold wire, high bonding stability, significant cost advantages | LED packages (High power, COB, EMC, PPA, etc.) and some IC packages |
| YGA1B | 74Au | |||
| YGA2 | 60Au | |||
| YGA3 | 70Au | |||
| YGA5 | 50Au |
