| Project | Lion 2600 | |
| Machine performance | Equipment accuracy | ±5μm@3sigma ,<0.15°@3sigma |
| Chip rotation | <0.15°@3sigma | |
| Cycle | ≤8s(Excluding temperature curve) ≤2s | |
| Bonding head accuracy | X(lum),Y(1um)Z(lum),Theta (0.01deg) | |
| Glue dispensing accuracy | X(±5um),Y(±5um) | |
| Material handling capability | Chip size | 0.15x0.15-15x15mm |
| Substrate size | Max 110mm*200mm | |
| Loading materials | 2 | |
| Bangtou System | Bonding power | 0.3-10N |
| Visual recognition system | PR system | 256 grey level |
| Resolving power | 4096pixelx3072pixel*Optional according to needs | |
| Angle tolerance | ±0.01° | |
| Machine size and weight | Size | L1480*W1460*H2240(mm) |
| Weight | 2100kg |
